Why Dahesemi?
Pick & Place
Chip packaging is undergoing profound change — in placement accuracy, in speed, in process. From lead frame to substrate, wire bond to flip chip, planar to 3D, RDL to TSV. Our work is to keep contributing value inside the Pick & Place step.
Thermo-compression
In the CoWoS and HBM TSV process flows, thermo-compression and hybrid bonding are the bottleneck China most needs to break through — and the equipment is among the most critical in the line.
History & Experience
Twenty-five years of building semiconductor packaging equipment — across four organisations and two parallel product lines.
Case Studies
How our platforms perform on real production lines.