Thermo-Compression Bonding
In the CoWoS and HBM TSV process flows, thermo-compression and hybrid bonding are the bottleneck China most needs to break through — and the equipment is among the most critical in the line.
Where TCB sits in the flow
Thermo-compression bonding applies controlled heat and force to join stacked die through micro-bumps or hybrid bonded surfaces. In HBM, it is what turns individual DRAM die into a high-bandwidth stack; in CoWoS, it places die onto the silicon interposer.
Why it is hard
Thermo-compression bonding sits at the intersection of force control, thermal management and sub-micron placement, which is why only a handful of suppliers worldwide have taken it to volume production — leaving stacking lines dependent on a very narrow supply base. Drawing on more than twenty years of accumulated experience in memory thermo-compression bonding, we have developed two core platforms and are among the small number of companies with command of this process technology.