About DaheSemi
Die bonders and chip sorters for advanced packaging — built by a team that keeps machining, assembly and calibration in-house.
What we build
DAF, flip-chip and epoxy die attach, chip sorting, and panel-level platforms for fan-out packaging. The current flagship, the D-MARS 8900, places at ±5μm across a 600×600mm panel at 30K UPH, feeding from 8-inch and 12-inch wafers.
Where the work happens
Three sites: the Shenzhen headquarters and R&D centre, an R&D centre in Hsinchu, and the factory in Tongcheng, Anhui. Machining, assembly, calibration and testing stay in-house rather than being subcontracted — which is what lets spare parts and engineering changes move without waiting on an outside supplier.
How the team is organised
R&D is split into mechanical design, electrical design, control system development and back-end software — the four disciplines a placement platform needs under one roof.