Bonder

All Models

DAF Die Bonder

D-MARS PLUS

D-MARS PLUS

D-MARS PLUS

2nd-generation DAF die bonder for DRAM memory

3500UPH
Throughput: ±10μm
Accuracy @3σ

D-MARS 6600

D-MARS 6600

D-MARS 6600

DAF thermo-compression die bonder

2500UPH
Throughput: ±15μm
Accuracy @3σ

FC Bonder

D-MARS FC

D-MARS FC

D-MARS FC

General-purpose flip-chip die bonder

6000UPH
Throughput: ±5μm
Accuracy @3σ

Epoxy Bonder

D-MARS HS

D-MARS HS

D-MARS HS

High-speed epoxy (silver paste) die bonder

15000UPH
Throughput: 250ms
Cycle Time

Chip Sorter

Rushes A12

Rushes A12

Rushes A12

Fully automatic chip sorter

500ms
Cycle Time: 3Bin
Output Zones

Rushes S12

Rushes S12

Rushes S12

Semi-automatic chip sorter

6KUPH
Throughput: 600ms
Cycle Time

DaheSemi — Advancing the Pick & Place frontier