History & Experience
Twenty-five years of building semiconductor packaging equipment — across four organisations and two parallel product lines.
The team behind DaheSemi did not start in 2022. It started in 2000, inside Taiwan's Industrial Technology Research Institute, taking on semiconductor packaging equipment development from first principles.
Two product lines grew in parallel from there — semiconductor back-end packaging, and camera module assembly. The pivotal moment came in 2010, when GPM Precision's semiconductor division split in two: GMM Precision kept the business inside the listed group, while the core engineering team founded TwinWin and carried the know-how forward. That second branch is what became DaheSemi.
- Organisation2000
Team formed at ITRI
The founding team came together at Taiwan's Industrial Technology Research Institute, taking on semiconductor packaging equipment development from first principles. The same year they went to Hitachi in Japan for technology study and transfer.
- Semiconductor packaging line2004
Taiwan's first DAF die bonder
In June 2004 the team developed Taiwan's first DAF die bonder at GPM Precision, specified feature-for-feature against the Hitachi DB 700 series. It shipped to SPIL and ASE the same year.
- Camera module line2006
Taiwan's first glass bonder GS 700
The team developed Taiwan's first glass bonder for camera modules — the GS 700 — opening a second product line alongside semiconductor packaging.
- Camera module line2009
CHIP GAP inspection & AOI team
As handset camera shipments took off, the team was first to develop a CHIP GAP inspection machine and built up its AOI technology group.
- Organisation2010
GPM semiconductor division splits in two
GPM Precision's semiconductor division was spun off as GMM Precision, a separate listed-group entity that kept the original equipment business. In parallel the core engineering team left GPM and founded TwinWin, carrying the die bonder, chip sorter and camera-module line know-how forward — the line that leads directly to DaheSemi.
- Camera module line2011
Hsinchu plant completed
The new Hsinchu facility gave the team volume production capability; a film lamination machine was also completed, giving full-line integration capability for the CIS industry.
- Camera module line2014
CIS Bonder in volume production
CIS Bonders shipped in volume to camera module makers including Sunny and Q Technology; the team also launched CCM assembly line integration services, extending into complete solutions.
- Organisation2019 – 2024
Rooted in mainland China
The team moved its centre of gravity to mainland China, extending both the semiconductor packaging and camera module product lines into the mainland market.
- Organisation2022
DaheSemi founded
DaheSemi (Shenzhen) was formally established in March 2022, now covering panel-level packaging, memory, HBM and 2.5D/3D process equipment — with R&D in Shenzhen and Hsinchu and plants in Shenzhen and Tongcheng, Anhui.
